Laser Cutting Sapphire Disk | IPG's IX Series

IPG’s IX-280-F is a Class 1 workstation optimized for thermal processing applications such as cutting of sapphire, silicon wafers, ceramics and metal foils. Configurable with a selection of fiber delivery lasers, the system incorporates a high-precision X-Y gantry stage system and dual magnification vision system for highly precise part positioning and machining. In this example, technicians laser cut holes in a sapphire disk. Website: https://www.ipgphotonics.com/en/contact Email: sales.us@ipgphotonics.com